Organic el display device

ABSTRACT

A display device includes: a display panel which is flexible, and including a pair of flat portions held in a flat state, and a bending portion provided between the pair of the flat portions and held to be bendable; a first support supporting one of the pair of the flat portions in a flat state; a second support supporting the other of the pair of the flat portions in a flat state; and a joint joining the first support and the second support together. The joint is flexible and provided not to interfere with the bending portion.

TECHNICAL FIELD

The present invention relates to an organic EL display device.

BACKGROUND ART

Self-luminous organic EL display devices including an organicelectroluminescence (EL) element have recently received attention, asdisplay devices alternative to liquid crystal display devices. As anorganic EL display device of this type, a repeatedly bendable organic ELdisplay device including a flexible resin substrate, and an organic ELelement and various kinds of films stacked on the resin substrate hasbeen proposed.

For example, Patent Document 1 discloses a display device including: aflexible display panel such as, so-called, an organic EL display panel;a pair of housings on which the display panel is laid; and a hingepivotably joining the pair of housings together. When the pair ofhousings pivots, the display device folded is opened flat for use.

CITATION LIST Patent Documents

PATENT DOCUMENT 1: Japanese Unexamined Patent Publication No. 2013-50547

SUMMARY OF THE INVENTION Technical Problem

As the display device disclosed in Patent Document 1, an organic ELdisplay device having an organic EL display panel secured to a pair ofhousings joined together with a hinge mechanism is likely to createdistortion between the pair of housings because of such reasons as poorfinishing accuracy of the hinge mechanism. Here, since the flexibleorganic EL display panel is in the form of a thin film (for example,approximately 100 μm thick), even if the distortion created between thepair of housings is as slight as several tens of micrometers, wrinklesare inevitably formed on a bendable bending portion, of the organic ELdisplay panel, positioned between the pair of housings.

The present invention is conceived in view of the above problems, andattempts to reduce formation of wrinkles on a bending portion of anorganic EL display panel.

Solution to the Problem

In order to achieve the above object, an organic EL display deviceaccording to the present invention includes: an organic EL display panelwhich is flexible, the organic EL display panel including a pair of flatportions held flat, and a bending portion provided between the pair ofthe flat portions and held to be bendable; a first support supportingone of the pair of the flat portions in a flat state; a second supportsupporting the other one of the pair of the flat portions in a flatstate; and a joint joining the first support and the second supporttogether, wherein the joint is flexible and provided not to interferewith the bending portion.

Advantages of the Invention

According to the present invention, the joint joins together the firstsupport supporting one of the pair of the flat portions and the secondsupport supporting the other of the pair of the flat portions. The jointis flexible and provided not to interfere with the bending portion ofthe organic EL display panel, reducing formation of wrinkles on abending portion of the organic EL display panel.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an organic EL display device in an openstate according to a first embodiment of the present invention.

FIG. 2 is a top view of the organic EL display device in the open stateaccording to the first embodiment of the present invention.

FIG. 3 is a bottom view of the organic EL display device in the openstate according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view of a modification of a plate memberincluded in the organic EL display device according to the firstembodiment of the present invention.

FIG. 5 is a plan view illustrating a pixel structure of an organic ELdisplay panel included in the organic EL display device according to thefirst embodiment of the present invention.

FIG. 6 is a cross-sectional view of the organic EL display panel takenfrom line VI-VI of FIG. 5.

FIG. 7 is an equivalent circuit diagram of an organic EL element layerincluded in the organic EL display panel of the organic EL displaydevice according to the first embodiment of the present invention.

FIG. 8 is a cross-sectional view of the organic EL element layerincluded in the organic EL display panel of the organic EL displaydevice according to the first embodiment of the present invention.

FIG. 9 is a perspective view of the organic EL display device in afolded state according to the first embodiment of the present invention.

FIG. 10 is a side view explaining a neutral plane of a bending portionof the organic EL display panel, in the folded state, of the organic ELdisplay device according to the first embodiment of the presentinvention.

FIG. 11 is a perspective view of an organic EL display device in an openstate according to a second embodiment of the present invention.

FIG. 12 is a top view of the organic EL display device in the open stateaccording to the second embodiment of the present invention.

FIG. 13 is a bottom view of the organic EL display device in the openstate according to the second embodiment of the present invention.

FIG. 14 is a side view explaining a neutral plane of a bending portionof the organic EL display panel, in a folded state, of the organic ELdisplay device according to the second embodiment of the presentinvention.

FIG. 15 is a side view explaining the neutral plane of the bendingportion of the organic EL display panel, in the folded state, of amodification of the organic EL display device according to the secondembodiment of the present invention.

FIG. 16 is a perspective view of an organic EL display device in an openstate according to a third embodiment of the present invention.

FIG. 17 is a top view of the organic EL display device in the open stateaccording to the third embodiment of the present invention.

FIG. 18 is a bottom view of the organic EL display device in the openstate according to the third embodiment of the present invention.

FIG. 19 is a cross-sectional view of the organic EL display device takenalong line XIX-XIX of FIG. 17.

FIG. 20 is a cross-sectional view of the organic EL display device takenalong line XX-XX of FIG. 17.

FIG. 21 is a side view explaining a neutral plane of a bending portionof the organic EL display panel, in a folded state, of the organic ELdisplay device according to the third embodiment of the presentinvention.

FIG. 22, corresponding to FIG. 20, is a cross-sectional view of amodification of the organic EL display device according to the thirdembodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

Embodiments of the present invention will now be described in detailwith reference to the drawings. Note that the present invention is notlimited to the following embodiments.

First Embodiment

FIGS. 1 to 10 illustrate an organic EL display device according to afirst embodiment of the present invention. FIGS. 1, 2, and 3 are aperspective view, a top view, and a bottom view of an organic EL displaydevice 70 a, in an open state, of this embodiment. FIG. 4 is across-sectional view of a plate member 40 e, which is a modification ofa plate member 40 a included in the organic EL display device 70 a. FIG.5 is a plan view illustrating a pixel structure of an organic EL displaypanel 30 included in the organic EL display device 70 a. FIG. 6 is across-sectional view of the organic EL display panel 30 taken from lineVI-VI of FIG. 5. FIG. 7 is an equivalent circuit diagram of an organicEL element layer 20 included in the organic EL display device 30. FIG. 8is a cross-sectional view of an organic EL layer 17 included in theorganic EL display device 30. FIG. 9 is a perspective view of theorganic EL display device 70 a in a folded state. FIG. 10 is a side viewexplaining a neutral plane Na of a bending portion C of the organic ELdisplay panel 30, in the folded state, of the organic EL display device70 a.

As illustrated in FIGS. 1 to 3, the organic EL display device 70 aincludes: a plate member (a joint) 40 a; an organic EL display panel 30provided on a front face (upper side in FIG. 1) of the plate member 40a; and a first support 51 and a second support 52 provided on a backface (lower side in FIG. 1) of the plate member 40 a. Here, the rigidityof the plate member 40 a (for example, approximately 11 N/mm) is higherthan that of the organic EL display panel 30 (for example, approximately8 N/mm).

As illustrated in FIG. 6, the organic EL display panel 30 includes: abase resin substrate layer 10; a stress adjusting layer 8 provided closeto a back face (lower side in FIG. 6) of the base resin substrate layer10; an organic EL element layer 20; a color filter 22; a counter resinsubstrate layer 23; a touch panel 25; and a hard coat layer 28. Theorganic EL element layer 20, the color filter 22, the counter resinsubstrate layer 23, the touch panel 25, and the hard coat layer 28 areprovided in this stated order close to a front face (upper side in FIG.6) of the base resin substrate layer 10. As illustrated in FIG. 5, adisplay region (not shown) of the organic EL display panel 30 hassub-pixels P arranged in matrix. As illustrated in FIG. 5, sub-pixels Phaving red light emission regions Lr for displaying gradation of a redcolor, sub-pixels P having green light emission regions Lg fordisplaying gradation of a green color, and sub-pixels P having bluelight emission regions Lb for displaying gradation of a blue color areplaced next to one another in the display region (not shown) of theorganic EL display panel 30. Note that, in the display region of theorganic EL display device 30, the three adjacent sub-pixels P eachhaving one of the red light emission region Lr, the green light emissionregion Lg, and the blue light emission region Lb constitute one pixel.The organic EL display panel 30 is flexible. As illustrated in FIGS. 1and 2, the organic EL display panel 30 includes: a pair of flat portionsFa and Fb held flat; and a bending portion C provided between the pairof the flat portions Fa and Fb, and held to be bendable. The size of theorganic EL display panel 30 is, for example, approximately 10 cm inwidth (a longitudinal direction in FIG. 2), 18 cm in length (a lateraldirection in FIG. 2), and 100 μm in thickness.

The base resin substrate layer 10 is made of, for example, polyimideresin and the like.

The stress adjusting layer 8 controls a position of the neutral planeNa, of the organic EL display device 30, under bending stress (see FIG.10). Here, the stress adjustment layer 8 is, for example, a plastic filmmade of such a material as polyethylene terephthalate. As illustrated inFIG. 6, between the base resin substrate layer 10 and the stressadjustment layer 8, a first adhesive layer 9 made of, for example, epoxyresin adhesive, etc. is provided.

As illustrated in FIG. 7, the organic EL element layer 20 includes:multiple gate lines 11; multiple source lines 12 a; and multiple powersupply lines 12 b. The multiple gate lines 11 are provided on the baseresin substrate layer 10 (see FIG. 6) to extend parallel to one anotherin a lateral direction in FIG. 7. The multiple source lines 12 a areprovided on the base resin substrate layer 10 to extend parallel to oneanother in a longitudinal direction in FIG. 7. The multiple power supplylines 12 b are provided on the base resin substrate layer 10 to beadjacent to the source lines 12 a, and extend parallel to one another inthe longitudinal direction in FIG. 7. A moisture-proof layer is providedbetween the base resin substrate layer 10 and a gate layer includingsuch lines as the gate lines 11. The moisture-proof layer is configuredas a single-layer film, such as a silicon nitride film, a silicon oxidefilm, or a silicon oxynitride film, or a multilayer film of two or moreof these films.

As illustrated in FIG. 7, the organic EL element layer 20 furtherincludes: multiple first TFTs 13 a each provided for an associated oneof the sub-pixels P; multiple second TFTs 13 b each provided for anassociated one of the sub-pixels P; and multiple capacitors 13 c eachprovided for an associated one of the sub-pixels P. Here, as illustratedin FIG. 7, each of the first TFTs 13 a is connected to the associatedgate line 11 and source line 12 a. As illustrated in FIG. 7, each of thesecond TFTs 13 b is connected to the associated first TFT 13 a and powersupply line 12 b. For example, the first TFTs 13 a and the second TFTs13 b each include: a gate electrode provided on the base resin substratelayer 10 via the moisture-proof layer; a gate insulating film coveringthe gate electrode; a semiconductor layer provided on the gateinsulating film to overlap the gate electrode; and source and drainelectrodes provided on the semiconductor layer to face each other. Asillustrated in FIG. 7, each of the capacitors 13 c is connected to theassociated first TFT 13 a and power supply line 12 b. For example, thecapacitors 13 c each include: a pair electrodes; and a gate insulatingfilm provided between the pair of these electrodes. One of the twoelectrodes is made of the same material as that of the gate lines 11,and is formed in the same layer as that in the gate lines 11. The otherone of the two electrodes is made of the same material as that of thesource lines 12 a, and is formed in the same layer as that in the sourcelines 12 a. Note that, in this embodiment, the first TFTs 13 a and thesecond TFTs 13 b are, for example, bottom gate TFTs. Alternatively, thefirst TFTs 13 a and the second TFTs 13 b may be top gate TFTs.

As illustrated in FIG. 6, the organic EL element layer 20 furtherincludes: an interlayer insulating film 14 substantially covers thefirst TFTs 13 a (see FIG. 7), the second TFTs 13 b, and the capacitors13 c (see FIG. 7); and multiple first electrodes 15 provided on theinterlayer insulating film 14. Each of the first electrodes 15 isprovided as an anode electrode for an associated one of the sub-pixelsP, and connected to an associated one of the second TFTs 13 b. Here, asillustrated in FIG. 6, the interlayer insulating film 14 covers eachsecond TFT 13 b, except for a portion of the drain electrode of thesecond TFT 13 b. Note that the interlayer insulation film 14 is made of,for example, photosensitive acrylic resin and the like. The multiplefirst electrodes 15 are arranged in matrix on the interlayer insulatingfilm 14 such that each first electrode 15 corresponds to an associatedone of the sub-pixels P. As illustrated in FIG. 6, the first electrode15 of each sub-pixel P is connected to the drain electrode of theassociated second TFT 13 b via an associated contact hole formed in theinterlayer insulating film 14. The first electrodes 15 function toinject holes (positive holes) into an organic EL layer 17 to bedescribed below. To increase the efficiency in injecting positive holesinto the organic EL layer 17, the first electrodes 15 are preferablymade of a material having a high work function. Examples of materialsfor the first electrodes 15 include metal materials such as silver (Ag),aluminum (Al), vanadium (V), cobalt (Co), nickel (Ni), tungsten (W),gold (Au), calcium (Ca), titanium (Ti), yttrium (Y), sodium (Na),ruthenium (Ru), manganese (Mn), indium (In), magnesium (Mg), lithium(Li), and ytterbium (Yb). The first electrodes 15 may also be made of analloy of, for example, magnesium (Mg)/copper (Cu), magnesium (Mg)/silver(Ag), sodium (Na)/potassium (K), astatine (At)/astatine dioxide (AtO₂),lithium (Li)/aluminum (Al), lithium (Li)/calcium (Ca)/aluminum (Al), orlithium fluoride (LiF)/calcium (Ca)/aluminum (Al). Furthermore, thematerial for the first electrodes 15 may also be a conductive oxide suchas tin oxide (SnO), zinc oxide (ZnO), indium tin oxide (ITO), and indiumzinc oxide (IZO), for example. Moreover, the first electrodes 15 may bemultilayers containing the above materials, such as ITO/Ag, IZO/Ag, andIZO/Al. Examples of the materials having a high work function, out ofconductive oxides include indium tin oxide (ITO) and indium zinc oxide(IZO).

As illustrated in FIG. 6, the organic EL element layer 20 furtherincludes: an edge cover 16 formed in a grid pattern to cover peripheralportions of the first electrodes 15; and the organic EL layer 17covering portions of the first electrodes 15 exposed from the edge cover16. Examples of materials for the edge cover 16 include an inorganicfilm of silicon dioxide (SiO₂), silicon nitride (SiNx, where x is apositive number) such as trisilicon tetranitride (Si₃N₄), and siliconoxynitride (SiNO), and an organic film of (photosensitive) polyimideresin, (photosensitive) acrylic resin, (photosensitive) polysiloxaneresin, and novolak resin. As illustrated in FIG. 8, the organic EL layer17 includes: a positive hole injection layer 1; a positive holetransport layer 2; a light-emitting layer 3; an electron transport layer4; and an electron injection layer 5, which are provided on the firstelectrodes 15 in this order.

The positive hole injection layer 1 is also called an anode bufferlayer, and functions to bring the energy levels of the first electrodes15 and the organic EL layer 17 close to each other and to increaseefficiency in injection of positive holes from the first electrodes 15into the organic EL layer 17. Here, examples of materials for thepositive hole injection layer 1 include: triazole derivatives,oxadiazole derivatives, imidazole derivatives, polyarylalkanederivatives, pyrazoline derivatives, phenylenediamine derivatives,oxazole derivatives, styrylanthracene derivatives, fluorenonederivatives, hydrazone derivatives, and stilbene derivatives.

The positive hole transport layer 2 functions to increase efficiency intransporting positive holes from the first electrodes 15 to the organicEL layer 17. Here, examples of materials for the positive hole transportlayer 2 include porphyrin derivatives, aromatic tertiary aminecompounds, styryl amine derivatives, polyvinylcarbazole,poly-p-phenylene vinylene, polysilane, triazole derivatives, oxadiazolederivatives, imidazole derivatives, polyarylalkane derivatives,pyrazoline derivatives, pyrazolone derivatives, phenylenediaminederivatives, arylamine derivatives, amine-substituted chalconederivatives, oxazole derivatives, styrylanthracene derivatives,fluorenone derivatives, hydrazone derivatives, stilbene derivatives,hydrogenated amorphous silicon, hydrogenated amorphous silicon carbide,zinc sulfide, and zinc selenide.

When a voltage is applied from the first electrodes 15 and a secondelectrode 18 to be described below, the light-emitting layer 3 receivespositive holes and electrons injected from the first and secondelectrodes 15 and 18. In the light-emitting layer 3, the positive holesand the electrons are recombined with each other. The light-emittinglayer 3 is made of a material having high luminous efficiency. Examplesof materials for the light-emitting layer 3 include metal oxinoidcompounds (8-hydroxyquinoline metal complexes), naphthalene derivatives,anthracene derivatives, diphenylethylene derivatives, vinylacetonederivatives, triphenylamine derivatives, butadiene derivatives, coumarinderivatives, benzoxazole derivatives, oxadiazole derivatives, oxazolederivatives, benzimidazole derivatives, thiadiazole derivatives,benzothiazole derivatives, styryl derivatives, styrylamine derivatives,bis(styryl)benzene derivatives, tris(styryl)benzene derivatives,perylene derivatives, perinone derivatives, aminopyrene derivatives,pyridine derivatives, rodamine derivatives, acridine derivatives,phenoxazone, quinacridone derivatives, rubrene, poly-p-phenylenevinylene, and polysilane.

The electron transport layer 4 functions to efficiently move electronsto the light-emitting layer 3. Here, examples of materials for theelectron transport layer 4 includes, as organic compounds, oxadiazolederivatives, triazole derivatives, benzoquinone derivatives,naphthoquinone derivatives, anthraquinone derivatives,tetracyanoanthraquinodimethane derivatives, diphenoquinone derivatives,fluorenone derivatives, silole derivatives, and metal oxinoid compounds.

The electron injection layer 5 functions to bring the energy levels ofthe second electrode 18 and the organic EL layer 17 close to each other,and to increase efficiency in injecting electrons from the secondelectrode 18 into the organic EL layer 17. This function contributes toreduction in the drive voltage of the organic EL element layer 20. Theelectron injection layer 5 may also be called a cathode buffer layer.Here, examples of materials for the electron injection layer 5 includeinorganic alkaline compounds such as lithium fluoride (LiF), magnesiumfluoride (MgF₂), calcium fluoride (CaF₂), strontium fluoride (SrF₂), andbarium fluoride (BaF₂), aluminum oxide (Al₂O₃), and strontium oxide(SrO).

As illustrated in FIG. 6, the organic EL element layer 20 furtherincludes: the second electrode 18 provided as a cathode electrode tocover the organic EL layer 17 and the edge cover 16; and a sealing film19 covering the second electrode 18. Here, the second electrode 18functions to inject electrons into the organic EL layer 17. To increaseefficiency in injecting electrons into the organic EL layer 17, thesecond electrode 18 is preferably made of a material having a low workfunction. Examples of materials for the second electrode 18 includesilver (Ag), aluminum (Al), vanadium (V), cobalt (Co), nickel (Ni),tungsten (W), gold (Au), calcium (Ca), titanium (Ti), yttrium (Y),sodium (Na), ruthenium (Ru), manganese (Mn), indium (In), magnesium(Mg), lithium (Li), and ytterbium (Yb). The second electrode 18 may alsobe made of, for example, an alloy of magnesium (Mg)/copper (Cu),magnesium (Mg)/silver (Ag), sodium (Na)/potassium (K), astatine(At)/astatine dioxide (AtO₂), lithium (Li)/aluminum (Al), lithium(Li)/calcium (Ca)/aluminum (Al), and lithium fluoride (LiF)/calcium(Ca)/aluminum (Al). The second electrode 18 may also be made of, forexample, a conductive oxide such as tin oxide (SnO), zinc oxide (ZnO),indium tin oxide (ITO), and indium zinc oxide (IZO). Moreover, thesecond electrode 18 may be multilayers containing the above materials,such as ITO/Ag. Examples of materials having a low work function includemagnesium (Mg), lithium (Li), magnesium (Mg)/copper (Cu), magnesium(Mg)/silver (Ag), sodium (Na)/potassium (K), lithium (Li)/aluminum (Al),lithium (Li)/calcium (Ca)/aluminum (Al), and lithium fluoride(LiF)/calcium (Ca)/aluminum (Al). The sealing film 19 functions toprotect the organic EL layer 17 against moisture and oxygen. Examples ofmaterials for the sealing film 19 include inorganic materials such assilicon dioxide (SiO₂), aluminum oxide (Al₂O₃), silicon nitride (SiNx,where x is a positive number) such as trisilicon tetranitride (Si₃N₄),and silicon carbonitride (SiCN), and organic materials such as acrylate,polyurea, parylene, polyimide, and polyamide.

The color filter 22 includes, for example, a black matrix layer formedin a grid pattern, multiple color resist layers, such as a red layer, agreen layer, and a blue layer, each provided to an associated one ofsub-pixels P, and an overcoat layer covering the black matrix layer andthe color resist layers. As illustrated in FIG. 6, between the organicEL element layer 20 and the color filter 22, a second adhesive layer 21made of, for example, UV delay-curing adhesive and the like is provided.The color filter 22 is formed on the counter resin substrate layer 23.

The counter resin substrate layer 23 is made of, for example, polyimideresin and the like.

The touch panel 25 includes, for example, a base film and a capacitivetouch panel layer provided on the base film. As illustrated in FIG. 6,between the counter resin substrate layer 23 and the touch panel 25, athird adhesive layer 24 made of, for example, epoxy resin adhesive andthe like is provided.

The hard coat layer 28 is made of, for example, a UV curableorganosilicon resin and the like. As illustrated in FIG. 6, the hardcoat layer 28 is formed on a hard coat substrate 27 including a plasticfilm made of, for example, polyethylene terephthalate and the like. Asillustrated in FIG. 6, between the touch panel 25 and the hard coatsubstrate 27, a fourth adhesive layer 26 made of, for example, epoxyresin adhesive and the like is provided.

The organic EL display panel 30 in the above configuration functions asfollows: in each of the sub-pixels P, a gate signal is input through thegate line 11 to the first TFT 13 a to turn the first TFT 13 a on, apredetermined voltage corresponding to a source signal is writtenthrough the source line 12 a into the gate electrode of the second TFT13 b and the capacitor 13 c, and the magnitude of a current from thepower supply line 12 b is determined based on the gate voltage of thesecond TFT 13 b. The determined current is supplied to thelight-emitting layer 3 so that the light-emitting layer 3 emits light,thereby displaying an image. In the organic EL display device 30, evenif the first TFT 13 a is turned off, the gate voltage of the second TFT13 b is retained by the capacitor 13 c. Thus, the light-emitting layer 3keeps emitting light until the first TFT 13 a receives a gate signal ina subsequent frame.

As illustrated in FIG. 1, the first support 51 supports one of the flatportions in a flat state; namely the flat portion Fa, of the organic ELdisplay panel 30. Moreover, as illustrated in FIG. 1, the second support52 supports the other of the flat portions in a flat state; namely theflat portion Fb, of the organic EL display panel 30. Here, the firstsupport 51 and the second support 52 have rigidity. Examples of thefirst support 51 and the second support 52 are made of rigid materials.The rigid materials include metal plates such as an aluminum plate or astainless steel plate having a thickness ranging from 1 millimeter toseveral millimeters, or resin plates made of such materials asacrylonitrile-butadiene-styrene copolymer (ABS) resin, polystyrene (PS)resin, and polycarbonate (PC) resin. In addition, the first support 51and the second support 52 may be provided with, for example, a ribstructure adding rigidity to the first and second supports 51 and 52.

As illustrated in FIG. 1, the plate member 40 a is a joint joining thefirst support 51 and the second support 52 together. The plate member 40a does not overlap with the bending portion C of the organic EL displaypanel 30, so that the plate member 40 a is provided not to interferewith bending portion C. Moreover, as illustrated in FIG. 1, the platemember 40 a is provided between, and bonded to, (i) a pair of the flatportions Fa and Fb of the organic EL display panel 30 and (ii) the firstand second supports 51 and 52. In addition, as illustrated in FIGS. 1 to3, the plate member 40 a is provided with an opening 41 a correspondingto the bending portion C of the organic EL display panel 30. The opening41 a is a through opening in the thickness direction of the plate member40 a, and shaped into a rectangle in plan view. The width of the opening41 a is approximately 10 mm (about 5 mm on each side) wider than thewidth of the organic EL display panel 30, and the length of the openingis the same as the length of the bending portion C (for example,approximately 9.4 mm with a curvature radius of 3 mm). Here, the platemember 40 a is flexible, and made of, for example, an Ni—Ti superelasticalloy and the like having a thickness of approximately 100 μm. Note thatthe superelastic alloy has a characteristic called “superelasticity.”The superelasticity is a characteristic showing resistance againstplastic deformation even if large strain is applied. In other words,even if bent or stretched, the superelastic alloy is immediatelyrecovered to have the original shape when the bending or stretchingforce is released; that is, the superelastic alloy is elastic as rubber.In this embodiment, the plate member 40 a described as an example is ofa single-layer structure. Alternatively, the plate member 40 a may be ofa three-layer structure as illustrated in FIG. 4.

Specifically, as illustrated in FIG. 4, the plate member 40 e includes,for example, a back face layer (a third layer) 6 a made of asuperelastic alloy having a thickness of approximately 40 μm, anintermediate layer (a first layer) 7 provided on the back face layer 6 aand made of an inorganic film (for example, a silicon nitride film andthe like) having a thickness of approximately 20 μm, and a surface layer(a second layer) 6 b provided on the intermediate layer 7 and made of asuperelastic alloy having a thickness of approximately 40 μm. Here, therelationship rigidity=cross-sectional area×Young's modulus/length holds.In order to increase the rigidity of the plate member, thecross-sectional area of the plate member may be increased; whereas ifthe plate member is made thicker, strain inevitably increases, and ifthe plate member is made wider, the width of a frame region around thedisplay area inevitably increases. In addition, a material having a highYoung's modulus is likely to cause brittle fracture such that even asmall strain would break the plate member. Therefore, in the platemember 40 e, the intermediate layer 7 made of a brittle material havinga high Young's modulus (300 GPa) is formed to be relatively thin, andthe back face layer 6 a and the surface layer 6 b, made of asuperelastic alloy sandwiching the intermediate layer 7, are formed tobe relatively thick. Such a structure makes it possible to reduce thebrittle fracture and achieve, for example, a high rigidity ofapproximately 24 N/mm.

The organic EL display device 70 a having the above configuration isaccommodated in, for example, a pair of housings 61 and 62 joined by ahinge mechanism 63. The organic EL display device 70 a can transforminto (i) an open state (see FIGS. 1 to 3) in which the flat portion Fa,the bending portion C, and the other flat portion Fb are arranged in asingle plane, and (ii) a folded state (FIG. 9) in which the bendingportion C bends so that the pair of the flat portions Fa and Fb faceeach other. Here, since the neutral plane Na of the bending portion C isas long as the neutral plane Nb, of the plate member 40 a, correspondingto the bending portion C. In the folded state, as illustrated in FIG.10, the bending portion C protrudes from the opening 41 a of the platemember 40 a, so that the bending portion C of the organic EL displaypanel 30 does not interfere with the plate member 40 a.

Note that, in this embodiment, the plate member 40 a has a singleopening portion 41 a formed to correspond to the bending portion C as anexample. Alternatively, the plate member may have multiple openings tohave multiple bending portions, or the plate member may have multipleopenings formed side by side to form a single bending portion.

As can be seen, the organic EL display device 70 a of this embodimentcan provide the following advantages.

(1) The first support 51 supporting one flat portion Fa of the organicEL display panel 30 and the second support 52 supporting the other flatportion Fb of the organic EL display panel 30 are joined together by theplate member 40 a made of a superelastic alloy provided so as not tointerfere with the bending portion C outside the bending portion C.Hence, without relying on the hinge mechanism 63, the plate member 40 acan maintain the positional relationship between the pair of the flatportions Fa and Fb parallel with each other. Such a feature reduces therisk of twisting the bending portion C provided between the pair of theflat portions Fa and Fb, contributing to curbing creation of wrinkles inthe bending portion C of the organic EL display panel 30. Furthermore,since the plate member 40 a is higher in rigidity than the organic ELdisplay panel 30, the stretch of the organic EL display panel 30 isrestricted by the plate member 40 a. Such a feature further contributesto curbing creation of wrinkles in the bending portion C of the organicEL display panel 30.

(2) The opening 41 a is formed in the plate member 40 a so that theorganic EL display device 30 does not interfere with the plate member 40a when the organic EL display device 70 a is in the folded state. Such afeature contributes to reducing the buckling of the bending portion C ofthe organic EL display device 30.

Second Embodiment

FIGS. 11 to 15 illustrate an organic EL display device according to asecond embodiment of the present invention. FIGS. 11, 12, and 13 are aperspective view, a top view, and a bottom view of an organic EL displaydevice 70 b, in an open state, of this embodiment. FIG. 14 is a sideview explaining the neutral plane Na of the bending portion C of theorganic EL display panel 30, in the folded state, of the organic ELdisplay device 70 b. FIG. 15 is a side view explaining the neutral planeNa of the bending portion C of the organic EL display panel 30, in thefolded state, of a modification of the organic EL display device 70 b.In the embodiments below, components equivalent to those illustrated inFIGS. 1 to 10 are denoted by the same reference characters, and thedetailed explanation thereof will be omitted.

As illustrated in FIGS. 11 to 13, the organic EL display device 70 bincludes: a frame member 40 b; the organic EL display panel 30 providedwithin the frame member 40 b; and the first and second supports 51 and52 provided on a back face (lower side in FIG. 11) of the frame member40 b.

As illustrated in FIG. 11, the frame member 40 b is provided as a jointjoining the first support 51 and the second support 52 together. Theframe member 40 b does not overlap with the bending portion C of theorganic EL display panel 30 so that the frame member 40 b does not tointerfere with bending portion C. Furthermore, the frame member 40 b isbonded to the first and second supports 51 and 52. In addition, asillustrated in FIGS. 11 to 13, the frame member 40 b has an opening 41 bformed to surround the organic EL display panel 30 in plan view. Theopening 41 b is a through opening in the thickness direction of theframe member 40 b, and shaped into a rectangle in plan view. The opening41 b is formed to be larger by approximately 0.5 mm at each side thanthe organic EL display panel 30. Here, the frame member 40 b isflexible, and made of, for example, an Ni—Ti superelastic alloy and thelike having a thickness of approximately 100 μm.

The organic EL display device 70 b having the above configuration isaccommodated in, for example, a pair of housings joined by a hingemechanism. The organic EL display device 70 b can transform into (i) anopen state (see FIGS. 11 to 13) in which the flat portion Fa, thebending portion C, and the other flat portion Fb are arranged in asingle plane, and (ii) a folded state in which the bending portion Cbends so that the pair of the flat portions Fa and Fb face each other.Here, since the organic EL display panel 30 is substantially as thick asthe frame member 40 b, as illustrated in FIG. 14, the neutral plane Naof the bending portion C overlaps with the neutral plane Nb of a portionof the frame member 40 b corresponding to the bending portion C suchthat the neutral plane Na and the neutral plane Nb are substantially inthe same position when viewed in a direction of the bending axis (in adirection perpendicular to the drawing plane). Note that, in the organicEL display device 70 a of the first embodiment, the neutral plane Na ofthe bending portion C and the neutral plane Nb of the portion of theplate member 40 a corresponding to the bending portion C are indifferent positions (see FIG. 10).

In this embodiment, for example, the organic EL display panel 30 is thesame in thickness as the frame member 40 b. Alternatively, the organicEL display panel and the frame member may have thicknesses illustratedin FIG. 15. Specifically, as illustrated in FIG. 15, a frame member 40 cmay be thicker (e.g., approximately 150 μm in thickness) than theorganic EL display panel 30 (approximately 100 μm in thickness asdescribed above), and the neutral plane Nb of the frame member 40 c andthe neutral plane Na of the organic EL display panel 30 maysubstantially be in the same position.

As can be seen, the organic EL display device 70 b of this embodimentcan provide the advantages below, as well as the above describedadvantage (1).

As to the advantage (1), the first support 51 supporting one flatportion Fa of the organic EL display panel 30 and the second support 52supporting the other flat portion Fb of the organic EL display panel 30are joined together by the frame member 40 b made of a superelasticalloy provided so as not to interfere with the bending portion C of theorganic EL display panel 30 outside the bending portion C. Hence,without relying on the hinge mechanism, the frame member 40 b canmaintain the positional relationship between the pair of the flatportions Fa and Fb parallel with each other. Such a feature reduces therisk of twisting the bending portion C provided between the pair of theflat portions Fa and Fb, contributing to curbing creation of wrinkles inthe bending portion C of the organic EL display panel 30.

(3) Since the organic EL display panel 30 is the same in thickness asthe frame member 40 b, when the organic EL display device 70 b is in thefolded state, the neutral plane Na of the bending portion C and theneutral plane Nb of a portion of the frame member 40 b corresponding tothe bending portion C are substantially in the same position. When theorganic EL display device 70 b is in the folded state, such a featureallows a curvature of the bending portion C and a curvature of a portionof the frame member 40 b corresponding to the bending portion C tocoincide with each other, contributing to reducing protrusion of thebending portion C of the organic EL display panel 30 in relation to theframe member 40 b.

(4) When the frame member 40 c is thicker than the organic EL displaypanel 30, and the neutral plane Nb of the frame member 40 c and theneutral plane Na of the organic EL display panel 30 are in the sameposition, the surface of the organic EL display panel 30 is positionedbelow the surface of the frame member 40 c. Such a feature contributesto protecting the surface of the organic EL display panel 30.

Third Embodiment

FIGS. 16 to 22 illustrate an organic EL display device according to athird embodiment of the present invention. FIGS. 16, 17, and 18 are aperspective view, a top view, and a bottom view of an organic EL displaydevice 70 d, in an open state, of this embodiment. FIGS. 19 and 20 arecross-sectional views of the organic EL display device 70 d taken alonglines XIX-XIX and XX-XX illustrated in FIG. 17. FIG. 21 is a side viewexplaining the neutral plane Na of the bending portion C of the organicEL display panel 30, in the folded state, of the organic EL displaydevice 70 d. FIG. 22 is a cross-sectional view of an organic EL displaydevice 70 e which is a modification of the organic EL display device 70d. FIG. 22 corresponds to FIG. 20.

As illustrated in FIGS. 16 to 18, the organic EL display device 70 dincludes: a frame member 40 d; an organic EL display panel 30 d providedwithin the frame member 40 d; and a first support 51 d and a secondsupport 52 d provided on a back face (lower side in FIG. 15) of theframe member 40 d.

The organic EL display panel 30 d is the organic EL display panel 30 ofthe first embodiment made thinner to approximately 50 μm in thickness.

As illustrated in FIGS. 16 to 18, and 20, the frame member 40 d isprovided as a joint joining together the first support 51 d and thesecond support 52 d not to interfere with bending portion C of theorganic EL display panel 30 d. Furthermore, the frame member 40 d isbonded to the first and second supports 51 d and 52 d. As illustrated inFIGS. 19 and 20, the frame member 40 d has a U-shaped cross-sectionopened inward to accommodate a peripheral end (e.g., a portion ofapproximately 2 mm from an edge of the panel) of the organic EL displaypanel 30, and not to interfere with the bending portion C of the organicEL display panel 30 d. Moreover, the frame member 40 d is flexible, andmade of, for example, an Ni—Ti superelastic alloy and the like having athickness of approximately 160 μm. Here, the frame member 40 d has, inthe center along the thickness thereof, a groove with a width ofapproximately 80 μm to accommodate the peripheral end of the organic ELdisplay panel 30 d with a thickness of approximately 50 μm. Thus, theframe member 40 d has the U-shaped cross-section. Hence, the framemember 40 d is thicker than the organic EL display panel 30 d, and theneutral plane Nb of the frame member 40 d and the neutral plane Na ofthe organic EL display panel 30 d are substantially in the sameposition. In order to accommodate the peripheral end of the organic ELdisplay panel 30 d, the frame member 40 d is formed in advance to bedivided into at least two members along the periphery of the framemember 40 d. After accommodating the organic EL display panel 30 d, thedivided members are integrated into one piece to form the frame member40 d.

The organic EL display device 70 d having the above configuration isaccommodated in, for example, a pair of housings joined by a hingemechanism. The organic EL display device 70 d can transform into (i) anopen state (see FIGS. 16 to 18) in which the flat portion Fa, thebending portion C, and the other flat portion Fb are arranged in asingle plane, and (ii) a folded state in which the bending portion Cbends so that the pair of the flat portions Fa and Fb face each other.

Note that in this embodiment, described as an example is the organic ELdisplay device 70 d including the frame member 40 d accommodating theperipheral end of the organic EL display device 30 d. Alternatively,described as an example may be the organic EL display device 70 eincluding a resin frame 45 accommodating the peripheral end of theorganic EL display panel 30. Specifically, as illustrated in FIG. 22,the organic EL display device 70 e accommodates, in the resin frame 45,the peripheral edge of the organic EL display device 70 b of the secondembodiment. As illustrated in FIG. 22, the resin frame 45 has a U-shapedcross-section opened inward to accommodate all of the frame member 40 band the peripheral end of the organic EL display panel 30. For example,the resin frame 45 is made of silicone resin and the like.

Moreover, in the second and third embodiments, the frame member 40 b (40c) and the frame member 40 d are exemplified as a joint to join thefirst and second supports together. Alternatively, the joint may be apair of straps arranged parallel to each other to join the first andsecond supports together.

As can be seen, the organic EL display device 70 d of this embodimentcan provide the advantages below, as well as the above describedadvantage (1).

As to the advantage (1), the first support 51 d supporting one flatportion Fa of the organic EL display panel 30 d and the second support52 d supporting the other flat portion Fb of the organic EL displaypanel 30 d are joined together by the frame member 40 d made of asuperelastic alloy provided so as not to interfere with the bendingportion C of the organic EL display panel 30 d. Hence, without relyingon the hinge mechanism, the frame member 40 d can maintain thepositional relationship between the pair of the flat portions Fa and Fbparallel with each other. Such a feature reduces the risk of twistingthe bending portion C provided between the pair of the flat portions Faand Fb, contributing to curbing creation of wrinkles in the bendingportion C of the organic EL display panel 30 d.

(5) Since the frame member 40 d is thicker than the organic EL displaypanel 30 d, and the neutral plane Nb of the frame member 40 d and theneutral plane Na of the organic EL display panel 30 d are in the sameposition, the surface of the organic EL display panel 30 d is positionedbelow the surface of the frame member 40 d. Such a feature contributesto protecting the surface of the organic EL display panel 30 d.Moreover, since the neutral plane Na of the bending portion C and theneutral plane Nb of a portion of the frame member 40 d corresponding tothe bending portion C are in the same position, the curvature of thebending portion C and the curvature of a portion of the frame member 40b corresponding to the bending portion C coincide with each other whenthe organic EL display device 70 d is in the folded state, contributingto reducing protrusion of the bending portion C of the organic ELdisplay panel 30 d in relation to the frame member 40 d.

(6) The peripheral end of the organic EL display panel 30 d isaccommodated in the frame member 40 d. Such a feature makes it possibleto reduce the risk of delamination of a surface layer (e.g., the hardcoat layer 28) from a panel end face in the organic EL display panel 30d. The peripheral end of the organic EL display panel 30 d isaccommodated in the frame member 40 d. Such a feature makes it possibleto reduce the risk of delamination of the organic EL display panel 30 dfrom the first and second supports 51 d and 52 d. The peripheral end ofthe organic EL display panel 30 d is accommodated in the frame member 40d. Such a feature makes it possible to reduce the risk of damage such aswrinkles and tears even if the panel end of the bending portion Creceives an impact.

(7) In the organic EL display device 70 e including the resin frame 45,the peripheral end of the organic EL display panel 30 is accommodated inthe resin frame 45. Such a feature makes it possible to reduce the riskof delamination of a surface layer (e.g., the hard coat layer 28) from apanel end face in the organic EL display panel 30.

Other Embodiments

In each of the above embodiments, described as an example is an organicEL display device including an organic EL display panel. Instead, thepresent invention may be applied to a flexible display device not usingorganic EL elements, and a lighting apparatus including an organic ELpanel.

In each of the above embodiments, described as an example is an organicEL display device whose organic EL display panel can bend inward.Instead, the present invention may be applied to an organic EL displaydevice whose organic EL display panel can bend outward.

In each of the above embodiments, described as examples are the organicEL display devices 70 a, 70 b, 70 d, and 70 e. Instead, the presentinvention may be implemented with the combinations of the constitutionalelements of the organic EL display devices 70 a, 70 b, 70 d, and 70 echanged in any given manners.

Moreover, in each of the above embodiments, described as an example isan organic EL layer having a stacked structure of the five layers,namely, the positive hole injection layer, the positive hole transportlayer, the light-emitting layer, the electron transport layer, and theelectron injection layer. Alternatively, the organic EL layer may have astacked structure of three layers including a positive hole injectionlayer-transport layer, a light-emitting layer, and an electron transportlayer-injection layer, for example.

In each of the above embodiments, described as an example is an organicEL display device in which the first electrode functions as the anodeand the second electrode functions as the cathode. Alternatively, thepresent invention is applicable to an organic EL display device in whichthe stacked structure of the organic EL element is inverted, so that thefirst electrode functions as the cathode and the second electrodefunctions as the anode.

In each of the above embodiments, described as an example is the organicEL display device including the TFT having, as the drain electrode, anelectrode connected to the first electrode. Alternatively, the presentinvention is applicable to an organic EL display device including theTFT having an electrode connected to the first electrode and called asource electrode.

INDUSTRIAL APPLICABILITY

As can be seen, the present invention is useful for a flexible organicEL display device.

DESCRIPTION OF REFERENCE CHARACTERS

-   C Bending Portion-   Fa, Fb Flat Portion-   Na, Nb Neutral Plane-   6 a Back Face Layer (Third Layer)-   6 b Surface Layer (Second Layer)-   7 Intermediate Layer (First Layer)-   30, 30 d Organic EL Display Panel-   40 a, 40 e Plate Member (Joint)-   40 b, 40 d Frame Member (Joint)-   41 a, 41 b Opening-   45 Resin Frame-   51, 51 d First Support-   52, 52 d Second Support-   63 Hinge Mechanism-   70 a, 70 b, 70 d, 70 e Organic EL Display Device

The invention claimed is:
 1. A display device comprising: a displaypanel which is flexible, the display panel including a pair of flatportions held flat, and a bending portion provided between the pair ofthe flat portions and held to be bendable; a first support supportingone of the pair of the flat portions in a flat state; a second supportsupporting another one of the pair of the flat portions in a flat state;and a joint joining the first support and the second support together,wherein the joint is flexible and provided not to interfere with thebending portion, and the joint is defined by a single monolithic platemember having an opening corresponding to the bending portion extendingthrough the plate member, the plate member having a portion not havingthe opening and provided between (i) the pair of the flat portions and(ii) the first and second supports.
 2. The display device of claim 1,wherein the joint is higher in rigidity than the display panel.
 3. Thedisplay device of claim 1, wherein the pair of the flat portions isfoldable by a hinge mechanism.
 4. The display device of claim 1, whereinthe joint is made of a superelastic alloy.
 5. The display device ofclaim 1, wherein the joint includes a first layer made of an inorganicfilm, a second layer made of a superelastic alloy provided on onesurface of the first layer, and a third layer made of a superelasticalloy provided on another surface of the first layer.
 6. The displaydevice of claim 1, wherein the display panel is an organic EL displaypanel.
 7. The display device of claim 1, wherein the plate memberincludes an outer peripheral edge positioned outside of a peripheraledge of the display panel.
 8. A display device comprising: a displaypanel which is flexible, the display panel including a pair of flatportions held flat, and a bending portion provided between the pair ofthe flat portions and held to be bendable; a first support supportingone of the pair of the flat portions in a flat state; a second supportsupporting another one of the pair of the flat portions in a flat state;and a joint joining the first support and the second support together,wherein the joint is flexible and provided not to interfere with thebending portion, the joint is defined by a single monolithic framemember having an opening formed to surround the display panel in planview extending through the frame member, and the frame member is asthick as the display panel.
 9. The display device of claim 8, wherein aneutral plane of the frame member and a neutral plane of the displaypanel are in the same position.
 10. The display device of claim 8,further comprising a resin frame having a U-shaped cross-section andopened inward to accommodate all of the frame member and a peripheralend of the display panel.
 11. The display device of claim 8, wherein thejoint is made of a superelastic alloy.
 12. The display device of claim8, wherein the joint includes a first layer made of an inorganic film, asecond layer made of a superelastic alloy provided on one surface of thefirst layer, and a third layer made of a superelastic alloy provided onanother surface of the first layer.
 13. The display device of claim 8,wherein the display panel is an organic EL display panel.
 14. Thedisplay device of claim 8, wherein the joint is defined by the framemember including an opening which surrounds the entire display panel ina single plane in the plan view.